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Focused Ion Beam – Scanning Electron Microscopy (FIBSEM)

The Helios 650 and G3 FIB-SEMs provide high resolution scanning electron microscopy (SEM), focused ion beam (FIB) milling and etching, energy dispersive X-ray scattering (EDS), and scanning transmission electron microscopy (STEM) capabilities to the Piri Technologies.  The SEM and FIB resolutions are 0.9 nm and 5 nm, respectively, allowing for high resolution 2D and 3D imaging and elemental analysis of a wide array of samples.  The broad range of capabilities of these microscopes makes them excellent platforms for stand-alone research as well as superior support tools for other highly specialized laboratory equipment such as the nano-CT scanner and the environmental transmission electron microscope (ETEM). 3D imaging of customer samples allows an in-depth, nano-scale view of the interior structure of materials. The data obtained from FIB-SEM imaging can then be used for advanced modeling or image analysis.